Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting ST-DW0125x65

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Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate.  The diamond wire  produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting.  Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.


Part Number EQ-DW0125x65
Tensile Strength 30 N
  • Electroplated diamond wire with 0.125 mm (+/-0.01) diameter based on a high strength steel wire
  • 20 microns diamond particle for effectively cutting and slicing of ceramic and crystal.
  • 65 meters (215 feet) per roll as standard package
  • Perfect for cutting Sapphire or SiC single crystal
  • Super quality made in USA
  • Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc


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