Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting ST-DW0125x65
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Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting. Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.
|Tensile Strength||30 N|
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