High Power NST Magnetron Sputtering Coater

High Power NST Magnetron Sputtering Coater

1.00

High power DC magnetron sputtering coater is a high power desktop magnetron plasma sputtering coater with a water cooling 2″ target head, water chiller and rotatable sample holder. The coating unit is designed for coating all metallic films up to 4″ diameter wafer including Zn, Al, Ti and carbon light film at an affordable cost. One Al target is included for immediate use.

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Description

TECHNICAL PARAMETER

High power NST magnetron sputtering coater uses PLC control panel to control the equipment, which is convenient and intuitive to operate.It has a 2-inch water cooling target head and a rotatable sample stage,The water cooling target makes the surface of the sample after coating not deformed due to excessive coating temperature, and even damages the sample; the sample stage can be rotated, and the sample can be rotated while coating to make the surface of the sample uniform after coating. The device is small in size and cost-effective. It is an ideal coating equipment for making various metal films. It can be equipped with various metal targets and vacuum pump.

 

High power NST magnetron sputtering coater specifications:

Input Voltage 220VAC 50/60Hz ,110 V power is available by using a 1000 W transformer (15 A fuse).
Output Power
  • 1600 VDC
  • 250 W
  • 150 mA max.
  • Built-in over current protection (>150 mA)
Specimen Chamber
  • Quartz glass tube, 165 mm OD.×150 mm ID×250 mm Height
Sputtering Head  &Specimen Stage
  • 2” flexible magnetron sputtering head with water cooling jacket is included
  • One 50 mm Dia stainless steel sample stage is rotatable from 0 – 5 RPM
  • One manually operated shutter for target protection.
  • Sputtering head holder is available for holding sputtering head while non-operation.
  • The distance between the sputtering head and sample stage is adjustable from 60 – 100 mm.
  • Max Coating area: 4″ diameter max.
  • One Air Cold Recirculating Water Chiller 10 L/min Flow is included for cooling sputtering head.
Control Panel
  • 6” color touch-screen control panel with PLC integration for easy operation.
  • One panel for all parameters monitor and control: vacuum, current.
Ultimate Vacuum Pressure
  • Built-in KF25 vacuum port
  • The system requires an Ar gas tank with pressure regulator. (not included)
  • < 1.0E-2 Torr by Vane vacuum pump (not included) for Au, Ag, Pt, Cu, Mo targets (not sensitive to air)
  • < 1.0E-5 Torr by Turbomolecular pump (not included) for Al, Mg, Li, Lr, Ti, Zn targets (sensitive to air)
  • The lowest vacuum may reach <4.0E-6 Torr by pumping overnight and baking
Gas Atmosphere
  • One needle valve installed to allow Ar gas inlet to achieve better plasma coating
  • The system requires an Ar gas tank with pressure regulator (not included)
Target l  One 2″  Copper target is included for testing, Target size: 2″ Dia.×2.5mm.

l  It also can coat Ag, Al, Cr, Ni, Pt, Ti, Sn, Li, Mg, etc. almost every kind of metallic material.

l  Warning: Aluminum ,Chromium or Nickel Target can be coating by this machine, but please view the Recommend Coating Method before using.Please using RF Plasma   Magnetron Sputtering for coating Alumina

Overall Dimension L 440 mm×W 330 mm × H 290 mm
Net Weight 20 kg
Warranty One year limited with lifetime support

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