Lab compact UV-ozone cleaner with 6″×6″ chamber

Lab compact UV-ozone cleaner with 6″×6″ chamber

1.00

Lab compact UV-ozone cleaner is a compact Ultraviolet (UV) Ozone cleaner, which is a dedicated system to remove a variety of contaminants from surfaces of substrates samples. UV Ozone cleaning is a simple to use dry process which is highly effective method to clean surfaces.

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Description

TECHNICAL PARAMETER

Lab compact UV-ozone cleaner’s cleaning effect is caused by irradiating the surface of a substrate with suitable lamps creating enough energy in the in the Ultra Violet spectrum range. It is photo-sensitized oxidation process by atomized Oxygen and high reactive Ozone. The UV radiation directly to the surface stimulates the reaction. Volatile hydrocarbon products are produced. The removal of hydrocarbons in nanometer thickness by oxidation results in ultra clean surfaces with significantly wettability. This is very important before thin film coating process of glass and ceramic surfaces.

Lab compact UV-ozone cleaner main features:

1.To remove a variety of contaminants from surfaces of substrates samples.

2.Use the dry process to clean surfaces with the highly effective method.

3.Generate energy at wave line between 254nm to 185nm.

4.There are Oxygen inlet port, Ozone removal pump, and LCD display unit.

5.Sample temperature measurement feature.

6.Buzzer for indicating completion of cleaning.

7.Locking feature for locking sample feeding tray to avoid opening during operation.

Lab compact UV-ozone cleaner specifications:

Input Power AC   220V±10%, 50/60Hz
UV Lamp
  • UV lamp power: 120W Max.
  • Wave length: 254 nm and 185 nm
  • Max substrate size: 150×150 mm (6″×6″)
Chamber & Sample Stage
  • Tray size: 176mm×168mm
  • Sample feeding: slide based
LCD Display
  • Time Duration: 1 – 99 sec / min / hr
  • Sample Temperature measurement feature
Compliance CE   certified
Warranty One-year limited warranty with lifetime support ( no warranty   for Pyrex glass chamber )
Application
  • Cleaning molecular contamination from SPTs, AFM tips, and surfaces
  • Curing UV-adhesives
  • UV-photopatterning of SAM surfaces
  • Oxidizing PDMS
  • Surface sterilization
  • Etch, pattern, sharpen
  • Clean MEMS devices
  • Clean substrate surfaces such as Si, Ge, GaAs and all oxide crystal  substrate
Consumable Parts Replacement lamps

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