Features
 |
- Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3, and LiTaO3 Wafer
- The cutting pressure is adjustable by the spring
- Cutting size:
- 100 x100 mm ( 4×4″)
- 200 x200 mm ( 8×8”)
- 300 x300 mm ( 12×12”)
- Made in Japan
|
Cutting Procedure |
- Adjust the height of the diamond scriber
- Tuning the pressure of the spring
- Placing the substrate
- Scribing
- Splitting the substrate
|
Replace Diamond Scriber
 |
- Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0
- Move the slide unit to the diamond scriber replacement position and remove the guide rod
- Turn the handle over 90 degrees to the left
- Loosen the screw by using the hex wrench and remove the diamond scriber
- Install the new diamond scriber and tighten the screw
- Return the handle to the scribing position and set the guide rod
|
| Product Dimensions |
 SYJ-DS100-LD: 210 mm (L) x 210 mm (W) x 140 mm (H) SYJ-DS200-LD: 310 mm (L) x 310 mm (W) x 140 mm (H) SYJ-DS300-LD: 410 mm (L) x 410 mm (W) x 140 mm (H)
|
| Compliance |
- No UL required because no electric
|
| Warranty |
- One year limited warranty with lifetime support
|
| Operational Manual |
|
| Application Notes |
- The minimum size of the substrate is at least twice of the thickness. Generally, it is 5 mm x 5 mm.
- Replace the diamond scriber when dull
- To avoid the spring to be degraded, turn the spring pressure dial to the initial position of 0 after use
- For the long-term use, wipe the slitting unit guide rod periodically and put grease
|
Reviews
There are no reviews yet.